Trademark Details For NEW JAPAN MEMS (Serial Number 87527032)

Electronic components manufacturing apparatus and systems;

Electronic circuits and parts thereof; Electrical communication machines, apparatus, devices and parts thereof; Electronic machines, apparatus, devices and parts thereof; Communication networks MEMS (Micro Electro Mechanical Systems) and parts thereof; RF (Radio Frequency) switches and parts thereof; Optical switches and parts thereof; MEMS (Micro Electro Mechanical Systems) devices and parts thereof; Sensors and parts thereof; Acceleration sensors and parts thereof; Gyro sensors and parts thereof; Pressure sensors and parts thereof; Mirror devices and parts thereof; Piezoelectric microphone and parts thereof; Ultrasonic devices and parts thereof; Piezoelectric thin film actuators and parts thereof; Micro relays and parts thereof;

Processing and assembling relating to electronic components; Processing and assembling relating to electronic circuits and parts thereof; Processing and assembling relating to electrical communication machines, apparatus, devices and parts thereof; Processing and assembling relating to RF (Radio Frequency) devices and parts thereof; Processing and assembling relating to RF (Radio Frequency) switches and parts thereof; Processing and assembling relating to optical switches and parts thereof; Processing and assembling relating to electronic machines, apparatus, devices and parts thereof; Processing and assembling relating to MEMS (Micro Electro Mechanical Systems) devices and parts thereof; Processing and assembling relating to sensors and parts thereof; Processing and assembling relating to acceleration sensors and parts thereof; Processing and assembling relating to gyro sensors and parts thereof; Processing and assembling relating to pressure sensors and parts thereof; Processing and assembling relating to mirror devices and parts thereof; Processing and assembling relating to piezoelectric microphone and parts thereof; Processing and assembling relating to ultrasonic devices and parts thereof; Processing and assembling relating to piezoelectric thin film actuators and parts thereof; Processing and assembling relating to micro relays and parts thereof; Manufacture of wafer for MEMS (Micro Electro Mechanical Systems); Advisory and consultancy services relating to manufacture of wafer for MEMS (Micro Electro Mechanical Systems);